FA SERVICES
 
   


Dualbeam FIB system
- integrates both the ion beam and electron beam into one system


Electron column is used to image the sample. The ion beam can be used to raster over the surface similar to electron beam in a scanning electron microscope (SEM). The focused ions will mill away the sample through atomic collision process.

An important capability derived from the FIB systemís milling capacity, is the creation of thin lamella for TEM. As the position of the ion beam can be controlled precisely, the lamella can be located at specific position that is of interest to the user. More ever, the milling is an atomic collision process. The lamella preparation procedure is therefore material independent.

Another capability is the formation of nanostructures for nanodevices.

Besides the milling capabilities, by adding a gas delivery system, it can convert the ion beam system into a deposition system.

Process control and failure analysis capabilities offered by FIB provide the fastest possible route-cause data to solve site specific failure modes.








FIB cross-sectioning of a microchip FA Services Singapore


FIB cross-sectioning of a microchip




TEM lamella FA Services Singapore


TEM lamella





ZnO nanorod FA Services Singapore


ZnO nanorod




ZnO nanorod array FA Services Singapore


ZnO nanorod array




Transmission Electron Microscopy
- to image samples at atomic scale

Applications:
- materials science
- nanotechnology
- semiconductor research. 








Metallic nanowire FA Services Singapore


Metallic nanowire




HRTEM of Metal film FA Services Singapore


HRTEM of metal film




Diffraction pattern of metal film FA Services Singapore


Diffraction pattern of metal film








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